Board parameters
| Sampling | Mass production | |
|---|---|---|
| layers | 2-64 L | 2-58 L |
| PCB thickness | 0.5-17.5mm | 0.6-10mm |
| Min. mechanical hole diameter | 0.1mm | 0.2mm |
| Min. laser hole diameter | 3mil | 4mil |
| HDI type: | 1+n+1、2+n+2、3+n+3 | 1+n+1、2+n+2 |
| Min. line width/space: | 3/3mil | 4/4mil |
| Tolerance of Impedance: | +/-5% | +/-10% |
| Max. Copper thickness: | 12oz | 6oz |
| Maximum board size | 18:1 | 16:1 |
| Maximum board size | 650mm X 1130mm | 610mm X 1100mm |
| Substrate type | FR4/Hi-Tg/Rogers/Halogen Free/ RCC/PTFE/Nelco/Mixed material | |
| Surface treatment | HASL、HASL PB FREE Immersion Gold/Tin/Silver Gold Finger Plating OSP、Immersion Gold + OSP | |
| Special processing | buried blind hole, terraced slots, metal substrate, embedded resistor,hybrid voltage, Rigid-Flex combination, back drilling, terraced golden finger. | |
