Existing 20 SMT patch production lines, equipped with new imported Fuji XPF, NXT3, automatic solder paste printing machine, ten temperature zone reflow oven, AOI, SPI and other high-end equipment, patch capacity of 16 million solder joints / day, especially good at high Precision, high-complexity veneer, the actual performance of ultra-complex veneers producing 40,000+ solder joints.
SMT capacity | 16 million solder joints / day |
SMT production line | 20 |
Throw rate | 1. Resistance capacity is 0.3% |
2, IC class without throwing material | |
Board type | POP / ordinary board / FPC / rigid-flex board / metal substrate |
Mounting component specifications | Stickable minimum package | 03015 Chip/0.35 Pitch BGA |
Minimum device accuracy | ±0.04mm | |
IC type patch accuracy | ±0.03mm | |
Mounting PCB Specifications | PCB size | 50*50mm - 686*508mm |
PCB thickness | 0.3-6.5mm |
